JPH0487644U - - Google Patents
Info
- Publication number
- JPH0487644U JPH0487644U JP1990130272U JP13027290U JPH0487644U JP H0487644 U JPH0487644 U JP H0487644U JP 1990130272 U JP1990130272 U JP 1990130272U JP 13027290 U JP13027290 U JP 13027290U JP H0487644 U JPH0487644 U JP H0487644U
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- insulating film
- semiconductor pellet
- stage
- supported
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990130272U JPH0487644U (en]) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990130272U JPH0487644U (en]) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487644U true JPH0487644U (en]) | 1992-07-30 |
Family
ID=31877628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990130272U Pending JPH0487644U (en]) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487644U (en]) |
-
1990
- 1990-11-30 JP JP1990130272U patent/JPH0487644U/ja active Pending